Job Information
Qualcomm Thermal Engineer, Entry to Staff Level in Hsinchu City, Taiwan
Company:
Qualcomm Semiconductor Limited
Job Area:
Engineering Group, Engineering Group > Packaging Engineering
Qualcomm Overview:
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.
General Summary:
Overview
Qualcomm’s Hardware System is seeking a talented Thermal Engineer to contribute to continued success of our industry-leading portfolio of chipset solutions. The qualified individual will be contributing to innovative solutions resolving complex thermal mgmt. challenges within Automotive space. Such individual should have in-depth understanding of heat transfer fundamentals and be an expert in electronics cooling of Automotive modules. He/she must be experienced in creating analytical and numerical models utilizing CFD tools. In addition, experience in conducting thermal experiments in support of various product development efforts is a must. Further, intimate knowledge of thermal mgmt. materials and their applications to enhance hardware thermal performance is required.
Responsibilities
Support thermal/mechanical projects from concept to production phase.
Design, set up, run, and deliver results for various thermal experiments.
Conduct test or research on materials and thermal solutions.
Manage technical projects across organization.
Perform thermal simulations utilizing CFD tools for product-level solutions and present results.
Skills and Experience
This position requires skillset and hands-on experience to enable test hardware/platforms and execute test vectors for the purpose of thermal validation and verification testing.
Ability to write scripts and data analysis.
Programming experience with Python, C/C++.
Debugging and bring up experience with test platforms required.
Ability to design thermal tests and execute per plan within a laboratory environment.
Around 2-6 years of industry experience in electronics cooling preferably related to Automotive applications.
Thorough understanding of cooling techniques for electronic components and equipment.
In-depth understanding of natural, forced convection cooling and liquid cooling. Exposure to cooling systems related to Automotive industry is a plus.
Must have design experience with PCBs, component placement, enclosures, and heat sinks.
Expertise in conducting CFD simulations utilizing tools such as ANSYS-Icepak or Flotherm.
Some experience with 3D geometry CAD tools such as Solidworks or Pro/ENGINEER.
Experience operating data acquisition equipment.
Excellent communication skills.
Education Requirements
Required: BSME
Preferred: MSME, or PhD in Mechanical Engineering
Keywords
Automotive, Heat transfer, CFD, ANSYS-Icepak, Flotherm, thermal management, thermal test, fans, natural convection, forced convection, radiation, conduction, liquid cooling, mechanical
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification